Kandou AI raises $225M Series A

Kandou AI specializes in the design of high-speed, and pin- and energy-efficient chip-to-chip links, SerDes, and associated technologies. The company announced a $225M Series A on March 23, 2026, from its base in Lausanne, CH. Investors and valuation were not disclosed in Crunchbase's round record; Lounge adds them as they are reported. It has raised more than $100M in total venture funding.

0Share to feed

Paid members see the full deals desk — every AI round and exit, filterable by type, sector and country, with investors and reported ARR, plus CSV exports. Developer membership is $9/mo.

See plans →Log in

Discussion · 0

Create a free account to join the discussion.

Every AI deal, decoded — free for members

Members get unlimited reads, can save and upvote, and see who else is building in the same space. Launch beta: free accounts created before Oct 20 get every paid feature — 82 of 100 slots left.

Create your free account Log in