GlobalFoundries signs five-year deal to make TSMC silicon interposers for AI chips in New York

The agreement is valued at $2 billion and covers interposers for TSMC's CoWoS-S packaging ecosystem. The parts will have embedded deep trench capacitors, meaning the capacitors are built into the interposer itself. The companies have not disclosed the production capacity to be installed, and GlobalFoundries shares climbed as much as 7% on the news. The deal comes four months after TSMC and Amkor announced a 10-year agreement for advanced packaging in Arizona. TSMC also plans to establish its first advanced packaging facility in Arizona by 2029. Today, many of those chips still need to be shipped back to Asia for advanced packaging after fabrication. GlobalFoundries will make only one component, while TSMC remains the customer and the company whose system integrates it. For AI builders, advanced packaging has become a major constraint on AI chip production. A domestic interposer source could let TSMC clients brand their products as completely made and packaged in America, which matters for public sector and sovereign buyers. Because volume output starts in 2028, accelerator supply through 2027 will not change.